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Платформы CompactPCI

Advantech continues its commitment to develop, deliver and support the CompactPCI® product line. With over 10-years of experience in CompactPCI blades and system design, we have delivered thousands of products to OEMs across the world. Advantech CompactPCI platforms are widely used in mission-critical industrial and telecommunication applications that demand enhanced reliability, high-availability and serviceability as well as long-term upgradability and manageability.

Advantech CompactPCI blades are designed with the latest Intel® silicon available and offer a comprehensive upgrade path for legacy products as well as a solid base for new designs. Each new blade iteration is designed to facilitate product continuity in industrial and telecom applications by providing simple and economical upgrades which renew and extend the lifecycle of deployed OEM equipment. We continue to diligently select components with guaranteed longevity of supply in order to prolong product lifecycles as long as possible for customers. We follow industry standard quality and revision control processes and offer worldwide RMA services for faster serviceability.

For increased throughput and multi-core scalability, every one of our new SBC designs supports a comprehensive range of Intel® processors, chipsets and controllers, designed for optimum performance and scalability whilst reducing overall power consumption and carbon footprint. Advantech’s value-add comes from a broad range of flexible design options on standard product with the ability to customize when it makes the best technological and economical sense for the OEM.

With an emphasis on local expertise and experience, Advantech's support teams and alliance partners offer on-site consultancy to address driver and software compatibility in new designs. In addition, when product modification or customization secures better overall system interoperability or facilitates re-certification needs, Advantech's design teams are available to share their design experience and knowledge of NEBS and similar standards to provide the optimum system solution.

3U CompactPCI
Advantech’s Industrial Automation division, designs and manufactures a wide range of 3U CompactPCI products for industrial communications and data acquisition. Full details can be found here..

Product Categories

  • VPX

    • MIC-6314

      The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the Intel® 4th/ 5th Generation Core® embedded platform with the increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native conduction-cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel’s latest Gigabit Ethernet controller. Intel’s next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
    • MIC-6330

      Based on the Intel® 6th Generation Core® and Xeon® E3 L v5 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (from one port to four ports) of PCI Express gen.3 via the backplane to the highest performance mainstream peripherals and I/O cards,, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by Intel’s integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard conduction-cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 3rd, 4th UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
    • MIC-6313

      The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the Intel® 4th/ 5th Generation Core® and Xeon® E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the Intel® 4th/ 5th Generation Core® and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native conduction-cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a cost-efficient, modular storage. By using Intel’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by intel’s latest Gigabit Ethernet controller. Intel’s next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
    • MIC-6311

      Advantech’s MIC-6311 is a single processor VPX blade based on the Intel® 4th generation Core® i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Core® processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support conduction-cooling heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using Intel’s latest powerful PCH (Lynx Point) with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by intel’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers the up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
  • 3U CompactPCI

    Advantech 3U CompactPCI Enclosures support CPCI platforms and CPCI chassis. Advantech works closely with CompactPCI® enclosure manufacturers and supply a wide range of chassis from 1U to 12U.

  • Платы 6U CompactPCI для установки модулей XMC/PMC

    This section contains Advantech’s Intel®-based CompactPCI single board computers, rear transition modules and peripheral boards, including XMCs and PMCs. Please note that Advantech’s Industrial Automation division, designs and manufactures a wide range of 3U CompactPCI products for industrial communications and data acquisition. Full details can be found here.

    • Процессорные платы

      Advantech’s Intel®-based CompactPCI single board computers are available in many configurations. The boards range from high-performance CPU boards for mission-critical telecom applications to more all-round processor boards for multi-purpose applications. Our high-performance 6U CompactPCI boards feature the latest Intel® processor technology with exceptional I/O expandability for graphics, networking and storage. These boards are designed to meet state-of-the-art needs in high density computer telephony and telecom applications as well as wide range of industrial, rugged and military requirements.
    • Carrier Boards

      Carrier Boards
    • Модули последовательных интерфейсов

      Complete suite of rear transition boards for accessing the I/O interfaces of Advantech's CPU boards
  • Корпуса для плат CompactPCI 6U

    Advantech works closely with a number of CompactPCI® enclosure manufacturers who supply a wide range of chassis from 1U to 12U. Contact your local sales office for details.

    • for 6U CompactPCI

      for 6U CompactPCI
    • for 3U CompactPCI

      Especially for your 3U Eurocard boards, Advantech provides 4U enclosures hosting up to 8 slots to meet the variety of CompactPCI enclosures (CPCI enclosures). CompactPCI 8-slot enclosures with high availability feature ample room for expansion, ideal for computing-intensive Blade Servers (Server Farms) and medium-scale Next Generation Network applications such as soft switches and signaling gateways. Powered by PICMG2.11 power supplies or an ATX 400W power supply, the CPCI blade chassis can be applied to cost sensitive applications. With the support of front Redundant Power Supplies and add-in cards as well as a simplified fan replacement mechanism built in, systems based on the our MIC-3022 can support a MTTR of 5 minutes or less. Having CPCI blade chassis be Redundant Power Supplied, our 4U enclosures are suitable in a wide range of applications in the industrial market requiring a robust, compact and reliable platform. Our MIC-3022 PLUS IO offers an uncomplicated and cost effective migration solution from parallel 3U to serial CPCI via the Plus IO standard instead of a bridge or an active logic. Advantech CompactPCI enclosure is the best support for your CompactPCI. For more solutions, please visit CompactPCI Solutions Telecommunication Solutions Video Solutions
  • Периферия CompactPCI

    Peripheral boards and modules for CompactPCI® products.

    • Модули PMC

      Various IEEE P1386.1 PMC Specification compliant modules for CPU boards' LAN connectivity expansion
    • Alarm-модули

      Intelligent system-independent monitoring modules for detecting abnormal system conditions and allowing users to take action before system failture